Capabilities & Processes

The Amitron Corporation team of professionally trained CAD/CAM engineers assure a seamless transition of your engineering data to the manufacturing floor. The following information outlines our engineering and manufacturing capabilities. Click here for a more complete Equipment List.

Data
Formats
  • Gerber
  • RS-274-X (imbedded apertures)
  • DXF
  • PDF
  • HPGL
  • Autocad
  • ASCII or EIA NC drill files
CAM
Capabilities
  • Dual photo plotters in-house
  • Valor Genesis software
  • Micro-modifications performed with customer approval
  • Panel/array optimization available
  • Pre-manufacturing design checks on every part
  • Artwork generation from bare boards or blueprints
  • Net list test fixture generation

Process
Options
  • Solder mask over bare copper
  • Gold plating
  • Carbon ink
  • OSP
  • White tin
  • Solder mask: LPI & SR1000
  • CNC skip scoring
Process
Capabilities   

Laminate Types:
CEM-1, CEM-3, FR-4, FR-406, FR-5 (all UL94V-0 rated), Arlon, Rogers, Thermagon, Nelco
Laminate Thickness: 0.004" to 0.250"
Copper Weight: 1/2 ounce to 12 ounce, finished
Layer Count: Single, Double, 4, 6, 8, 10, 12
Line & Space Widths: 0.005"/0.005"

Mechanical
Process
Tolerances
 Minimum annular ring +/- 0.005" 
 Board edge to edge, routed +/- 0.005" 
 Tooling hole to hole: +/- 0.002" 
 Hole to hole: +/- 0.002" 
 Tooling hole to edge: +/- 0.005" 
 Holes to copper registration: +/- 0.005" 
 Copper to solder mask: +/- 0.005" 
 Holes to legend: +/- 0.010" 
 Top to bottom registration: +/- 0.005" 
 Image line tolerance: 90% art work 
 Scoring tolerance: +/- 0.005" 
 Edge to copper: +/- 0.010" 
 Solder mask clearance: 0.005" 
 Minimum hole size: 0.010" 
 Minimum inside radius: 0.015" 
 Minimum trace width: 0.005" 
 Hole to hole clearance: 0.015" 
 Pad to pad clearance: 0.007" 
 Hole to board edge: 0.020" 
 Hole diameter: +/- 0.0025" 
 Board thickness: +/- 0.007" 

  Call for a Quote: (847) 290-9800 or Click here ©2002 Amitron Corporation